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Effect of introducing high temperature gradients on microstructure evolution and mechanical properties in Cu/Sn-3.5Ag/Ni microbump joints during thermocompression bonding

Crossref DOI link: https://doi.org/10.1007/s10854-025-15657-3

Published Online: 2025-09-01

Published Print: 2025-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Tang, Chu https://orcid.org/0000-0001-5835-8361
Chen, Zhuo

Zhu, Wenhui
Funding

Funding for this research was provided by:

Changsha Science and Technology Project (No. kq2102005))

the major key project of Pengcheng Laboratory (PCL2023A01)
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Text and Data Mining valid from 2025-09-01

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Article History

Received: 25 June 2025

Accepted: 22 August 2025

First Online: 1 September 2025

Declarations

:

: The authors have no relevant financial or nonfinancial interests to disclose.

: The article does not contain any studies with human participants or animals performed by any of the authors.

: No applicable.

: No applicable.

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