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Inspired by mortise–tenon structure: 3D interlocking design for direct Cu bonding of cu arrays without solder

Published Online: 2025-10-06

Published Print: 2025-10

Authors

Wang, Fengyi

Zhang, Jinghui

Zhang, Yihao

Chen, Hongtao https://orcid.org/0000-0003-0024-2539
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Text and Data Mining valid from 2025-10-01

Version of Record valid from 2025-10-01
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Article History

Received: 15 July 2025

Accepted: 14 September 2025

First Online: 6 October 2025

Declarations

:

: The authors declare that they have no conflicts of interest to disclose.

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