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Investigation of the thermo-mechanical reliability and microstructural evolution of Sn-58Bi/Sn-3.0Ag-0.5Cu composite solder

Published Online: 2025-10-21

Published Print: 2025-10

Authors

Jung, Myeong Jin

Lee, Jeong Il

Baek, Yi Hyeon

Kim, Jong-Min

Yim, Byung-Seung https://orcid.org/0000-0001-9859-8925
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Text and Data Mining valid from 2025-10-01

Version of Record valid from 2025-10-01
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Article History

Received: 18 August 2025

Accepted: 7 October 2025

First Online: 21 October 2025

Declarations

:

: The authors declare no known competing financial interests or personal relationships that can influence the work reported in this paper.

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