Effect of Sn–58Bi (SB) and Sn–3Ag–0.5Cu (SAC) mixing ratio on the thermo-mechanical reliability of SB/SAC composite solder
Crossref DOI link: https://doi.org/10.1007/s10854-025-16428-w
Published Online: 2025-12-22
Published Print: 2026-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jung, Myeong Jin
Lee, Jeong Il
Baek, Yi Hyeon
Kim, Jong-Min
Yim, Byung-Seung
Text and Data Mining valid from 2025-12-22
Version of Record valid from 2025-12-22
Article History
Received: 29 October 2025
Accepted: 18 December 2025
First Online: 22 December 2025
Declarations
:
: The authors declare no competing interests.