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The effects of indium on the microstructural evolution, lattice characteristics, thermal stability and mechanical performance in Sn-3.0Ag-0.5Cu solder alloys

Crossref DOI link: https://doi.org/10.1007/s10854-026-16641-1

Published Online: 2026-01-19

Published Print: 2026-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Mohamad Zaimi, N. S.

Mohd Salleh, M. A. A.

Abdul Aziz, Mohd Sharizal https://orcid.org/0000-0002-3271-9242
Muhammad Nadzri, N. I.

Zan Hazizi, M.

Kamonsuangkasem, K.

Tanthanuch, W.

Tancharakorn, S.

Mothong, N.

Khor, C. Y.
Funding

Funding for this research was provided by:

Universiti Sains Malaysia
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Text and Data Mining valid from 2026-01-01

Version of Record valid from 2026-01-19
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Article History

Received: 19 August 2025

Accepted: 5 January 2026

First Online: 19 January 2026

Declarations

:

: The authors have no relevant financial or non-financial interests to disclose.

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