Study on Sn58Bi/SAC305 low-temperature composite solder paste based on flake solder and its soldering performance
Crossref DOI link: https://doi.org/10.1007/s10854-026-16931-8
Published Online: 2026-03-17
Published Print: 2026-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, WenLong
Shang, Min
Li, ChenYu
Ke, JingLi
Sun, Han
Yu, Jie
Ma, HaiTao
Text and Data Mining valid from 2026-03-01
Version of Record valid from 2026-03-01
Article History
Received: 10 December 2025
Accepted: 1 March 2026
First Online: 17 March 2026
Declarations
:
: The authors declare no competing interests.