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Thermomechanical, mechanical, and physical characterization study of epoxy molding compound of memory packages under high-temperature aging

Published Online: 2026-03-18

Published Print: 2026-03

Authors

Liu, Vance

Chen, Yun-Ying

Tsai, Yi-Ting

Lin, Lu-Fu

Chung, Min-Hua

Chen, Chien-Ming

Gan, Chong Leong

Song, Jenn-Ming
Funding

Funding for this research was provided by:

Micron Technology
License Information

Text and Data Mining valid from 2026-03-01

Version of Record valid from 2026-03-01
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Article History

Received: 18 December 2025

Accepted: 5 March 2026

First Online: 18 March 2026

Declarations

:

: The authors declare no competing interests.

: The work has not involved any human participants nor animals.

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