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Heterogeneous SiO₂–SiCN die-to-wafer bonding: chemical asymmetry to drive interfacial reaction and byproduct consumption

Published Online: 2026-04-17

Published Print: 2026-04

Authors

Zhou, Anqi

Zhang, Yu

Ding, Fei

Lian, Ziqi

Li, Xuze

Jin, Renxi

Kang, Qiushi

Yang, Haibo

Cao, Liqiang

Wang, Qidong
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (62304250)

National Natural Science Foundation of China (92373208)

Beijing Superstring Academy of Memory Technology (SAMT-2022-PM02-16)
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Text and Data Mining valid from 2026-04-01

Version of Record valid from 2026-04-01
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Article History

Received: 3 February 2026

Accepted: 10 April 2026

First Online: 17 April 2026

Declarations

:

: The authors declare no competing interests.

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