Development of Heat Pipes for Cooling Thermally Stressed Electronics Elements
Crossref DOI link: https://doi.org/10.1007/s10891-019-02073-8
Published Online: 2019-11-27
Published Print: 2019-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Delendik, K. I.
Kolyago, N. V.
Penyazkov, O. G.
Voitik, O. L.
Text and Data Mining valid from 2019-11-01
Version of Record valid from 2019-11-01
Article History
Received: 11 May 2019
First Online: 27 November 2019