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Loop Thermosyphon for Cooling Heat-Loaded Electronics Components

Crossref DOI link: https://doi.org/10.1007/s10891-023-02840-8

Published Online: 2023-12-19

Published Print: 2023-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Vasiliev, L. L.

Zhuravlyov, A. S.

Kuz′mich, M. A.

Kulikovskii, V. K.

Olekhnovich, V. A.
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Text and Data Mining valid from 2023-11-01

Version of Record valid from 2023-11-01
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Article History

Received: 14 October 2022

First Online: 19 December 2023