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RETRACTED ARTICLE: Effect of Surface Cleaning Process on the Wafer Bonding of Silicon and Pyrex Glass

Published Online: 2023-01-12

Published Print: 2023-03

Authors

Du, Chao https://orcid.org/0000-0003-1927-4178
Zhao, Yali

Li, Yong
Funding

Funding for this research was provided by:

Doctoral Fund of Jinzhong University (jzxybsjjxm2019024)

Innovative Research Group Project of the National Natural Science Foundation of China (62105131)
License Information

Text and Data Mining valid from 2023-01-12

Version of Record valid from 2023-01-12
More Information

Article History

Received: 24 June 2022

Accepted: 21 November 2022

First Online: 12 January 2023

Change Date: 19 February 2026

Change Type: Correction

Change Details: This article has been retracted. Please see the Retraction Notice for more detail:

Change Details: https://doi.org/10.1007/s10904-026-04193-0

Declarations

:

: All the authors do not have any possible conflicts of interest.

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