Improved Thermal Performance of 640 nm Laser Diode Packaged by SiC Submount
Crossref DOI link: https://doi.org/10.1007/s10946-019-09788-2
Published Online: 2019-04-18
Published Print: 2019-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Xia, W.
Zhu, Z.
Li, X. Y.
Jiang, K.
Xu, X. G.
Text and Data Mining valid from 2019-03-01
Article History
Received: 27 November 2018
First Online: 18 April 2019