Simulation of Discharge Characteristics for the Plasma Etching of Large Area SiO2 Substrates
Crossref DOI link: https://doi.org/10.1007/s10946-020-09873-x
Published Online: 2020-05-30
Published Print: 2020-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhang, Jingwen
Fan, Bin
Li, Zhiwei
Gao, Guohan
Li, Bincheng
Yan, Zhiwu
Text and Data Mining valid from 2020-05-01
Version of Record valid from 2020-05-01
Article History
First Online: 30 May 2020