Dielectric Property Conduction Mechanism and Thermal Analysis of Cu 1 . 0 9 Ni 0 . 9 1 (HSeO3)2Cl2⋅4H2O Compound
Crossref DOI link: https://doi.org/10.1007/s10948-016-3798-2
Published Online: 2016-10-10
Published Print: 2017-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hentech, I. http://orcid.org/0000-0002-3981-543X
Kabadou, A.
Salah, A. Ben
Loukil, M.
Bessais, L.
License valid from 2016-10-10