Preparation of high temperature resistant Ag/PI/Cu composite nano particles inserted with PI insulating layer
Crossref DOI link: https://doi.org/10.1007/s10965-018-1631-2
Published Online: 2018-10-27
Published Print: 2018-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Qu, Chunyan
Li, Liaoliao
Liu, Changwei
Wag, Dezhi
Xiao, Wanbano
Zhu, Guangyu
Cao, Zhibo
Li, Hongfeng
Su, Kai
Text and Data Mining valid from 2018-10-27
Article History
Received: 12 March 2018
Accepted: 5 October 2018
First Online: 27 October 2018