Effect of O5+ ion implantation on the electrical and structural properties of Cu nanowires
Crossref DOI link: https://doi.org/10.1007/s10967-014-3262-3
Published Online: 2014-06-22
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chauhan, R. P.
Rana, Pallavi
Text and Data Mining valid from 2014-06-22