Effect of heat convection on the thermal and structure stress of high-power InGaN light-emitting diode
Crossref DOI link: https://doi.org/10.1007/s10973-014-4221-5
Published Online: 2014-11-28
Published Print: 2015-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hsu, Chih-Neng
Huang, Chun-Chieh
Wu, Yu-Hsuan
Text and Data Mining valid from 2014-11-28
