Thermal and mechanical properties of mandelic acid-incorporated soy protein films
Crossref DOI link: https://doi.org/10.1007/s10973-015-5035-9
Published Online: 2015-09-23
Published Print: 2016-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kumar, Rakesh
Anandjiwala, Rajesh D.
Kumar, Antresh
Text and Data Mining valid from 2015-09-23
