Rheological behavior of CuO/EG:W (20:80 v/v) nanofluid from a thermal perspective
Crossref DOI link: https://doi.org/10.1007/s10973-018-7082-5
Published Online: 2018-03-05
Published Print: 2019-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hemmat Esfe, Mohammad
Esfandeh, Saeed
Text and Data Mining valid from 2018-03-05
Article History
Received: 16 September 2017
Accepted: 14 February 2018
First Online: 5 March 2018