Document is current

Any future updates will be listed below

Optimal mechanical and thermal architecture of high-conductivity inserts for cooling an electronic piece

Crossref DOI link: https://doi.org/10.1007/s10973-019-08275-9

Published Online: 2019-05-13

Published Print: 2019-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark