Heat transfer performance of a porous copper micro-channel heat sink
Crossref DOI link: https://doi.org/10.1007/s10973-019-08547-4
Published Online: 2019-07-13
Published Print: 2020-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Qiu, Tengwei http://orcid.org/0000-0002-6771-9306
Wen, Donghui
Hong, Wangrong
Liu, Yuan
Text and Data Mining valid from 2019-07-13
Version of Record valid from 2019-07-13
Article History
Received: 7 November 2018
Accepted: 2 July 2019
First Online: 13 July 2019