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Microstructural Examination and Thermodynamic Analysis of Sn-1.5Ag-0.5Cu-x mass% Ni Lead-Free Solder Alloys

Published Online: 2024-06-03

Published Print: 2024-05

Authors

Eid, E. A. https://orcid.org/0000-0002-2194-222X
Fawzy, A.

Mansour, M. M.

Saad, G.

Amin, M.
Funding

Funding for this research was provided by:

Higher Technological Institute 10th of Ramadan
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Text and Data Mining valid from 2024-05-01

Version of Record valid from 2024-06-03
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Article History

Received: 24 August 2023

Accepted: 25 February 2024

First Online: 3 June 2024

Declarations

:

: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

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