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Exploring modeling and testing approaches for three-dimensional integrated thermal resistance of chiplets

Published Online: 2024-06-18

Published Print: 2024-07

Authors

Shang, Ruyue

Yao, Yue

Bi, Antong

Wang, Yucheng https://orcid.org/0000-0001-5746-0081
Wang, Shaoxi
Funding

Funding for this research was provided by:

Key Research and Development Projects of Shaanxi Province (No. 2023-YBGY-273)

National Natural Science Foundation of China (No. 62374135)
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Text and Data Mining valid from 2024-06-18

Version of Record valid from 2024-06-18
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Article History

Received: 2 December 2023

Accepted: 19 May 2024

First Online: 18 June 2024

Document is current