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Thermal interface materials for thermal management of microelectronic devices: a review

Crossref DOI link: https://doi.org/10.1007/s10973-025-14255-z

Published Online: 2025-05-20

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Chakarvarti, S. K.

Gehlawat, Devender https://orcid.org/0000-0002-1727-7271
Manocha, Aashish
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Text and Data Mining valid from 2025-05-20

Version of Record valid from 2025-05-20
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Article History

Received: 27 June 2024

Accepted: 7 April 2025

First Online: 20 May 2025