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Deep learning-driven topology optimization for heat dissipation of integrated electrical components using dual temperature gradient learning and MMC method

Crossref DOI link: https://doi.org/10.1007/s10999-023-09676-3

Published Online: 2023-10-03

Published Print: 2024-04

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Xu, Qi

Duan, Zunyi

Yan, Hongru

Geng, Dongling

Du, Hongze

Yan, Jun

Li, Haijiang
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (U1906233)

National Natural Science Foundation of China (11732004)

National Natural Science Foundation of China (12002278)

Key R&D Program of Shandong Province (2019JZZY010801)

Fundamental Research Funds for the Central Universities (DUT19ZD204)

Fundamental Research Funds for the Central Universities (DUT20ZD213)

Fundamental Research Funds for the Central Universities (DUT20LAB308)
License Information

Text and Data Mining valid from 2023-10-03

Version of Record valid from 2023-10-03
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Article History

Received: 8 February 2023

Accepted: 30 August 2023

First Online: 3 October 2023

Declarations

:

: On behalf of all authors, the corresponding author states that there is no conflict of interest.

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