Composition, Properties, Application, and Manufacturing Features of Binary Copper–Phosphorus Solders
Crossref DOI link: https://doi.org/10.1007/s11015-016-0362-z
Published Online: 2016-12-01
Published Print: 2016-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Tavolzhanskii, S. A.
Bazhenov, V. E.
Pashkov, I. N.
License valid from 2016-11-01
