The Effect of Nanocopper Additions in a Urea-Formaldehyde Adhesive on the Physical and Mechanical Properties of Particleboard Manufactured from Date Palm Waste
Crossref DOI link: https://doi.org/10.1007/s11029-015-9482-y
Published Online: 2015-03-19
Published Print: 2015-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Rangavar, H.
Hoseiny fard, M. S.
Text and Data Mining valid from 2015-03-01
