Increasing the Conductivity of Sintered Powder Al – Cu Material Due to Electroplating of Aluminium Particles with Copper
Crossref DOI link: https://doi.org/10.1007/s11041-023-00942-x
Published Online: 2023-11-08
Published Print: 2023-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Puteri, N. G.
Yu, Y. W.
Lee, W. H.
Text and Data Mining valid from 2023-09-01
Version of Record valid from 2023-09-01
Article History
Received: 6 October 2022
First Online: 8 November 2023