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Microscale mechanical properties dependent on the strain rate and temperature of cured isotropic conductive adhesive

Published Online: 2019-12-16

Published Print: 2021-06

Authors

Xiao, Gesheng

Li, Zhigang

Liu, Erqiang

Qiao, Li

Shu, Xuefeng

Sun, Ruijing
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (11802198, 11772217, 11702182)
License Information

Text and Data Mining valid from 2019-12-16

Version of Record valid from 2019-12-16
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Article History

Received: 25 February 2019

Accepted: 10 December 2019

First Online: 16 December 2019

Document is current