Thermal transient analysis of LED using carbon doped AlN film deposited on metal substrate as heat sink
Crossref DOI link: https://doi.org/10.1007/s11082-014-9985-0
Published Online: 2014-07-23
Published Print: 2015-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shanmugan, S.
Norazlina, M. S.
Mutharasu, D.
Text and Data Mining valid from 2014-07-23
