Etching Mechanisms and Surface Conditions for SiOxNy Thin Films in CF4 + CHF3 + O2 Inductively Coupled Plasma
Crossref DOI link: https://doi.org/10.1007/s11090-019-09973-w
Published Online: 2019-03-15
Published Print: 2019-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Junmyung
Kim, Jihun
Efremov, Alexander
Kim, Changmok
Lee, Hyun Woo
Kwon, Kwang-Ho
Text and Data Mining valid from 2019-03-15
Article History
Received: 20 December 2018
Accepted: 7 March 2019
First Online: 15 March 2019