Plasma Parameters and Silicon Etching Kinetics in C4F8β+βO2β+βAr Gas Mixture: Effect of Component Mixing Ratios
Crossref DOI link: https://doi.org/10.1007/s11090-020-10097-9
Published Online: 2020-06-13
Published Print: 2020-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Byung Jun
Efremov, Alexander
Nam, Yunho
Kwon, Kwang-Ho
Text and Data Mining valid from 2020-06-13
Version of Record valid from 2020-06-13
Article History
Received: 8 April 2020
Accepted: 4 June 2020
First Online: 13 June 2020