Multi-cycle Chamber Conditioning for Plasma Etching of SiO2: From Optimization to Stability in Lot Processing
Crossref DOI link: https://doi.org/10.1007/s11090-024-10493-5
Published Online: 2024-07-08
Published Print: 2024-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Nawaz, Ali
Cian, Alessandro
Ferrario, Lorenza
Picciotto, Antonino
Text and Data Mining valid from 2024-07-08
Version of Record valid from 2024-07-08
Article History
Received: 15 February 2024
Accepted: 30 June 2024
First Online: 8 July 2024
Declarations
:
: The authors declare no competing interests.