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Binding Effect of Copper on Physical, Mechanical, and Thermal Properties of Mg/Ti/Cu Composites

Crossref DOI link: https://doi.org/10.1007/s11106-024-00420-w

Published Online: 2024-06-01

Published Print: 2024-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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