Diamond–Silicon Carbide Composite as a Promising Material for Microelectronics and High-Power Electronics
Crossref DOI link: https://doi.org/10.1007/s11141-023-10226-2
Published Online: 2023-04-04
Published Print: 2022-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gordeev, S. K.
Korchagina, S. B.
Zapevalov, V. E.
Parshin, V. V.
Serov, E. A.
Text and Data Mining valid from 2022-10-01
Version of Record valid from 2022-10-01
Article History
Received: 11 February 2022
Accepted: 30 June 2022
First Online: 4 April 2023