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Effect of pH on the electrodeposition kinetics of copper from acetate and sulfosalicylate complex solutions

Crossref DOI link: https://doi.org/10.1007/s11172-014-0626-3

Published Online: 2015-03-07

Published Print: 2014-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Ostanina, T. N.

Uritskaya, A. A.

Rudoi, V. M.

Ostanin, N. I.

Ryabova, O. V.
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