Adhesive Strength of Ni–Cu Surface Alloy Formation by Low-Energy High-Current Electron Beam
Crossref DOI link: https://doi.org/10.1007/s11182-021-02237-1
Published Online: 2021-02-19
Published Print: 2021-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yakovlev, E. V.
Markov, A. B.
Shepel, D. A.
Petrov, V. I.
Neiman, A. A.
Text and Data Mining valid from 2021-02-01
Version of Record valid from 2021-02-01
Article History
Received: 15 July 2020
First Online: 19 February 2021