Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper Under Torsional Deformation
Crossref DOI link: https://doi.org/10.1007/s11223-018-9946-0
Published Online: 2018-03-27
Published Print: 2018-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, C. P.
Fan, J. K.
Li, F. G.
Liu, J. C.
Text and Data Mining valid from 2018-01-01
Article History
Received: 15 September 2017
First Online: 27 March 2018