Numerical Simulation of the Thermomechanical Behavior of a Hot Stamping Die
Crossref DOI link: https://doi.org/10.1007/s11223-018-9950-4
Published Online: 2018-03-27
Published Print: 2018-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jiang, Q. Y.
Zhao, H. Y
Yang, H. F.
Text and Data Mining valid from 2018-01-01
Article History
Received: 15 September 2017
First Online: 27 March 2018