High-Temperature Strength of Copper-Based Condensed Materials
Crossref DOI link: https://doi.org/10.1007/s11223-019-00036-1
Published Online: 2019-01-29
Published Print: 2018-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Rudnitskii, N. P.
Text and Data Mining valid from 2018-11-01
Article History
Received: 15 January 2018
First Online: 29 January 2019