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Thermal-aware application mapping using genetic and fuzzy logic techniques for minimizing temperature in three-dimensional network-on-chip

Crossref DOI link: https://doi.org/10.1007/s11227-023-05869-x

Published Online: 2024-01-21

Published Print: 2024-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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