Enhanced wafer map defect pattern classification through stacking ensemble method and data augmentation integration
Crossref DOI link: https://doi.org/10.1007/s11227-025-07113-0
Published Online: 2025-03-22
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Chiung-Jung
Chen, Yu-Han
Hsieh, Sun-Yuan
Text and Data Mining valid from 2025-03-22
Version of Record valid from 2025-03-22
Article History
Accepted: 22 February 2025
First Online: 22 March 2025
Declarations
:
: The authors declare no competing interests.