A Contact Mechanics Formulation for Predicting Dishing and Erosion CMP Defects in Integrated Circuits
Crossref DOI link: https://doi.org/10.1007/s11249-015-0550-1
Published Online: 2015-07-11
Published Print: 2015-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sierra Suarez, J. A.
Higgs, C. F. III
Text and Data Mining valid from 2015-07-11
Article History
Received: 16 January 2015
Accepted: 20 May 2015
First Online: 11 July 2015