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Nanoscale Wear Layers on Silicon Wafers Induced by Mechanical Chemical Grinding

Crossref DOI link: https://doi.org/10.1007/s11249-017-0911-z

Published Online: 2017-09-02

Published Print: 2017-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Zhang, Zhenyu

Du, Yuefeng

Wang, Bo

Wang, Ziguang

Kang, Renke

Guo, Dongming
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51422502, 51621064)

Changjiang Scholar Program of Chinese Ministry of Education
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Article History

Received: 24 May 2017

Accepted: 19 August 2017

First Online: 2 September 2017