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The Removal Mechanism of Monocrystalline Si in the Process of Double Diamond Abrasive Polishing by Molecular Dynamics Simulation

Published Online: 2021-04-26

Published Print: 2021-06

Authors

Dai, Houfu https://orcid.org/0000-0002-8914-614X
Yue, Haixia

Hu, Yang

Li, Ping
Funding

Funding for this research was provided by:

Postdoctoral Science Foundation of Jiangsu Province (2019M662765)

Key Laboratory of Advanced Control and Optimization for Chemical Processes (KY(2019)042)

Guizhou Science and Technology Department (JC(2020)1Y227)
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Text and Data Mining valid from 2021-04-26

Version of Record valid from 2021-04-26
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Article History

Received: 21 December 2020

Accepted: 18 April 2021

First Online: 26 April 2021

Declarations

:

: The authors declare that they have no competing interests.

: All authors have seen the manuscript and approved to submit to your journal, and we would greatly appreciate for your attention and consideration.

: Ethical approval was obtained from the College of Mechanical Engineering of Guizhou University.

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