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The Effect of Cu2+ Ions and Glycine Complex on Chemical Mechanical Polishing (CMP) Performance of SiC Substrates

Published Online: 2021-06-22

Published Print: 2021-09

Authors

Zhang, Ping

Chen, Guomei

Ni, Zifeng https://orcid.org/0000-0001-5974-7713
Wang, Yongguang

Teng, Kang

Qian, Shanhua

Bian, Da

Zhao, Yongwu
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51305166, 51675232)

Natural Science Research Project of Colleges and Universities in Jiangsu (19KJB460023)
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Text and Data Mining valid from 2021-06-22

Version of Record valid from 2021-06-22
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Article History

Received: 18 December 2020

Accepted: 8 June 2021

First Online: 22 June 2021

Document is current