Using Thermal-Aware VM Migration Mechanism for High-Availability Cloud Computing
Crossref DOI link: https://doi.org/10.1007/s11277-017-4582-8
Published Online: 2017-06-15
Published Print: 2017-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Ying-Jun
Horng, Gwo-Jiun
Li, Jian-Hua
Cheng, Sheng-Tzong
License valid from 2017-06-15