Surface Pile-Up Patterns in Indentation Testing of Cu Single Crystals
Crossref DOI link: https://doi.org/10.1007/s11340-014-9883-1
Published Online: 2014-04-15
Published Print: 2014-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kucharski, S.
Stupkiewicz, S.
Petryk, H.
License valid from 2014-04-15