Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep
Crossref DOI link: https://doi.org/10.1007/s11340-017-0258-2
Published Online: 2017-02-10
Published Print: 2017-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hasnine, M.
Suhling, J.C.
Prorok, B.C.
Bozack, M.J.
Lall, P.
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