Residual Thermal Strain Distribution Measurement of Underfills in Flip Chip Electronic Packages by an Inverse Approach Based on the Sampling Moiré Method
Crossref DOI link: https://doi.org/10.1007/s11340-019-00571-7
Published Online: 2020-01-15
Published Print: 2020-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Q. http://orcid.org/0000-0002-0645-6514
Ri, S.
Enomoto, T.
Text and Data Mining valid from 2020-01-15
Version of Record valid from 2020-01-15
Article History
Received: 2 July 2019
Accepted: 16 December 2019
First Online: 15 January 2020